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3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per module (www.tomshardware.com)

submitted 2 months ago by commander@lemmy.world to c/hardware@lemmy.ml

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[–] chonkyninja@lemmy.world -4 points 2 months ago (1 children)

Meanwhile my Mac Studio has 512GB on 4 modules which is apparently twice the density of this bullshit post.

[–] colin@lemmy.uninsane.org 3 points 2 months ago

they probably meant 512 Gb per IC, not per DIMM (which usually has 8-9 DRAM chips).

you're right about that last part though.